Thermaltake TG-30 Premium CPU/GPU Heatsink Thermal Compound

The item in this listing is a brand new sealed product in its original manufacture retail packaging. This product will come with a Minimum 1 year warranty.

Thermaltake TG-30 Premium CPU/GPU Heatsink Thermal Compound - 4g, CL-O023-GROSGM-A
Designed to lower CPU temperatures effectively, TG-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-30s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs.P/N: CL-O023-GROSGM-ATHERMAL CONDUCTIVITY: 4.5 W/m-kCOLOR: GrayWEIGHT: 4gVISCOSITY: 76 Pa-sTHERMAL IMPEDANCE: 0.185°C -in /WDENSITY: 2.55 g/cm

• 4.5 W/mK
• 50 to 200 C
• [Sustainability and Safety] The TG-30 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking
• [Sustainability and Safety] The TG-30 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking






















MPN: CL-O023-GROSGM-A
UPC: 841163075845